Debris-Free Laser Wafer Marking

THE INDUSTRY-LEADING SOFTMARK SOLUTION

The SC300’s Class 1 cleanroom compatibility and ultra-stable patented diode-pumped laser has helped to make it the industry-leading solution for cost-efficient, highly-readable soft marking of 300 mm wafers for identification and traceability.

PATENTED SUPERSOFTMARK® TECHNOLOGY

The SC300’s proprietary SuperSoftMark® technology, along with its patented diode-pumped laser, enables it to deliver debris-free soft marking, and allows the system to be installed in customer cleanrooms for high-volume production.

HIGH PERFORMANCE WITH GREATER CONTROL

The SC300 combines a high-performance laser system with best-in-class system-level closed-loop control and automated system data logging. All laser performance data is accurately logged to SPC levels of mark quality.

SEMI-COMPLIANT WAFER MARKING

TUI’s WaferMark® systems are fully compliant with SEMI standards for wafer marking: T7, M12 and M13. The SC300 can place multiple mark groups at any orientation on the wafer surface, within a 25 mm band around the wafer’s circumference.

System Specifications

MARKING
PERFORMANCE
UTILITY
REQUIREMENTS
MARKING FONTS
(STANDARD)
WORKSTATION
WAFER
HANDLING
PC
CONFIGURATION
LASER/OPTICS
CONTROL
SYSTEM
CERTIFICATION
Marking Mode Dot Matrix, Softmark
(straight line or arc marking)

SuperSoftMark® Process 0.02 particles/cm, 0.17 particle size measured over 5 mm area

Dot Diameter 50-70 μm +/- 10%

Dot Roundness<1.1 major to minor axis ratio

Dot Depth 2.4 μm +/- 0.4 μm

Throughput 125-180 wph, single pulse, 5x9 dot matrix, 12 characters
Throughput Edge Handling (option) 70-110 wph, single pulse, 5x9 dot matrix, 12 characters

Material Polished, non-coated, pure Si wafers
Electrical 200-240 VAC, single phase, 50/60 Hz, 23 FLA

Process Vacuum 20 Hg to 25 Hg. 3/8 in diameter press-lock connection

Mark Point Exhaust 20 CFM (560 I/min) flow rate max
2 in (50.8 mm) diameter port

Ambient Conditions Static Charge: 197 V/cm (550 V/in) max

Air-Cooled System Temp: 12.8 – 27 °C (55-80 °F)

Dimensions 78 in x 64.6 in x 47.4 in [HxWxD]
(1981.2 mm x 1641 mm x 1204 mm)

Weight EFEM: 1480 lb (671 kg)
Mark Enclosure: 1145 lbs (519 kg)
• 9x17 Single-Density Dot Matrix
• 10x18 Double Density Dot Matrix
• 5x9 SEMI Single Density Dot Matrix
• T1 SEMI Specs BC-412 Bar Code
• T7 2D Data Matrix
• Checksum Function (user selectable)
• Custom Fonts Available

Mark Char 80 char/group max

Mark Field
 50x50 mm after wafer aligned

Mark Location
 Within a 25 mm band around wafer circumference

Mark Repeatability
+/- 75 μm in X & Y relative to primary fiducial

Character Formation
 SEMI M12/M13

Enclosure Stainless steel, ISO Class 5 clean room compatible with ISO Class 2 mini-environment
Wafer Size 300 mm
200 mm bridge capability (optional)

Alignment Optical high-resolution wafer aligner

Wafer Transport Pick & place robot arm with single end effector

Cassette Ports Two 300 mm Ports
• Intel-Core CPU
• Windows 10, 32/64 Bit
• DDR3 ECC Memory
• PCI; PCIe x1; PCIe x16 slots
• 10/100/1000 T LAN Ports
• USB 3.0; USB 2.0 Ports
• RS232 ports - Includes Adapter Plates
• Intel 2.5 in Solid State Drives
• 2-Drawer drive carrier for 2.5 in drives
• DVD/DL Drive
Type Acousto-optic Q-switched,
TEM00Nd: YLF diode-pumped laser

Wavelength 1053 nm
Pulse Stability<0.5% at 1 khz

Optics Flat field focusing lens

Spot Size 50 μm, 60 μm or 70 μm

Depth 2.4 μm to 5.0 μm
• Keyboard and flat panel display
• Menu-driven “fill in the blank” software
• Multiple job file storage capability
• Fault and error logging capabilities
• System diagnostic indicators displayed on
front panel and electronic console
• SECS II/GEM interface
• Four color programmable signal tower

CE Mark
SEMI S2, S8, S14

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