Efficient hard marking that survives the harshest
processing of 100 mm - 300 mm wafers
THE INDUSTRY-LEADING SOFTMARK SOLUTION
SigmaDSC is the industry-leading solution for SEMI-standard compliant hard marking on semiconductor wafers. TUI’s control software enables the user to manage much of the system’s functionality. Programmable. Depth Control allows for adjusting marking depth, up to 100 μm.
DUAL-SPOT OPTICS™ FOR TWO SOFTWARE-SELECTED SPOT SIZES
SigmaDSC’s Dual-Spot Optics™ technology allows for the delivery of two separate software-controlled spot sizes on the same system. Depending on the laser deployed in the system, users can select from a range of calibrated spot sizes, from 50 μm to 110 μm.
HIGH PERFORMANCE WITH GREATER CONTROL
SigmaDSC combines a high-performance laser system with best-in-class system-level closed-loop control and automated system data logging. All laser performance data is accurately logged to SPC levels of mark quality.
SEMI-COMPLIANT WAFER MARKING
TUI’s WaferMark® systems are fully compliant with SEMI standards for wafer marking: T7, M12 and M13. SigmaDSC can place multiple mark groups at any orientation on the wafer surface, within a 25 mm band around the wafer’s circumference.
System Specifications
PERFORMANCE
REQUIREMENTS
(STANDARD)
HANDLING
CONFIGURATION
SYSTEM
Dot Diameter 50 -110 μm +/- 10%
Dot Depth 5-110 μm +/- 10%
Material Unpolished and Polished, Si wafers
Process Vacuum 20 Hg to 25 Hg. ¼ in diameter press-lock connection
Mark Point Exhaust 20 CFM (560 I/min) flow rate max
1.25 in (32 mm) diameter port
Air-Cooled System Temp: 12.8 – 27 °C (55-80 °F)
(1675 mm x 1461 mm x 978 mm)
Weight 1425 Ibs (646 kg)
• 10x18 Double Density Dot Matrix
• 5x9 SEMI Single Density Dot Matrix
• T1 SEMI Specs BC-412 Bar Code
• T7 2D Data Matrix
• Checksum Function (user selectable)
• Custom Fonts Available
Mark Char 80 char/group max
50x50 mm after wafer aligned
Mark Location
Within a 25 mm band around wafer circumference
+/- 75 μm in X & Y relative to primary fiducial
Character Formation
SEMI M12/M13
Alignment Optical high-resolution wafer aligner
*Optional Pick & Place with Single or Dual Flipper Robot
*Optional Two 300 mm Cassette Ports
• Windows 10, 32/64 Bit
• DDR3 ECC Memory
• PCI; PCIe x1; PCIe x16 slots
• 10/100/1000 T LAN Ports
• USB 3.0; USB 2.0 Ports
• RS232 ports - Includes Adapter Plates
• Intel 2.5 in Solid State Drives
• 2-Drawer drive carrier for 2.5 in drives
• DVD/DL Drive
TEM00Nd: YLF diode-pumped laser
Wavelength 1053 nm
Optics Flat field focusing lens
Depth 5-110 μm +/-10%
• Menu-driven “fill in the blank” software
• Multiple job file storage capability
• Fault and error logging capabilities
• System diagnostic indicators displayed on
front panel and electronic console
• SECS II/GEM interface
• Four color programmable signal tower
SEMI S2, S8, S14
