Efficient hard marking that survives

the harshest processing of 300 mm Wafers

THE INDUSTRY-LEADING HARDMARK SOLUTION

The HM300 is the industry-leading solution for SEMI-standard compliant hard marking on semiconductor wafers. TUI’s control software enables the user to manage much of the system’s functionality. Programmable. Depth Control allows for adjusting marking depth, up to 100 μm.

DUAL-SPOT OPTICS™ USER SELECTABLE, TOP/BOTTOM SIDE MARKING

The HM300’s Dual-Spot Optics™ technology allows for the delivery of two separate software-controlled spot sizes on the same system. Depending on the laser deployed in the system, users can select from a range of calibrated spot sizes, from 50 μm to 110 μm.

HIGH PERFORMANCE WITH GREATER CONTROL

The HM300 combines a high-performance laser system with best-in-class system-level closed-loop control and automated system data logging. All laser performance data is accurately logged to SPC levels of mark quality.

SEMI-COMPLIANT WAFER MARKING

TUI’s WaferMark® systems are fully compliant with SEMI standards for wafer marking: T7, M12 and M13. The HM300 can place multiple mark groups at any orientation on the wafer surface, within a 25 mm band around the wafer’s circumference.

System Specifications

MARKING
PERFORMANCE
UTILITY
REQUIREMENTS
MARKING FONTS
(STANDARD)
WORKSTATION
WAFER HANDLING
PC CONFIGURATION
LASER/OPTICS
CONTROL SYSTEM
CERTIFICATION
Marking Mode Dot Matrix, Hard Mark
(straight line or arc marking)

Dot Diameter 50 -110 μm

Dot Roundness<1.1 major to minor axis ratio

Dot Depth 5-110 μm +/- 10%

Throughput 65-85 wph, single pulse, 5x9 dot matrix, 12 characters

Material Unpolished and Polished, Si wafers
Electrical 200-240 VAC, single phase, 50/60 Hz, 23 FLA

Process Vacuum 20 Hg to 25 Hg. 3/8 in diameter press-lock connection

Mark Point Exhaust 20 CFM (560 I/min) flow rate max
2 in (50.8 mm) diameter port

Conditions Static Charge: 197 V/cm (550 V/in) max

Air-Cooled System Temp: 12.8 – 27 °C (55-80 °F)

Dimensions 78 in x 64.6 in x 47.4 in [HxWxD]
(1981.2 mm x 1641 mm x 1204 mm)

Weight EFEM: 1480 lbs. (671 kg)
Mark Enclosure: 1145 lbs. (519 kg)
• 9x17 Single-Density Dot Matrix
• 10x18 Double Density Dot Matrix
• 5x9 SEMI Single Density Dot Matrix
• T1 SEMI Specs BC-412 Bar Code
• T7 2D Data Matrix
• Checksum Function (user selectable)
• Custom Fonts Available

Mark Char 80 char/group max

Mark Field 50x50 mm after wafer aligned

Mark Location Within a 25 mm band around wafer
circumference

Mark Repeatability+/- 75 μm in X & Y relative to primary fiducial

Character Formation SEMI M12/M13
Enclosure Stainless steel, ISO Class 5 clean room compatible with ISO Class 2 mini-environment

Wafer Size 300 mm
200 mm bridge capability (optional)

Alignment Optical high-resolution wafer aligner

Wafer Transport Pick & place robot arm with single end effector

Cassette Ports Two 300 mm Ports

• Intel-Core CPU
• Windows 10, 32/64 Bit
• DDR3 ECC Memory
• PCI; PCIe x1; PCIe x16 slots
• 10/100/1000 T LAN Ports
• USB 3.0; USB 2.0 Ports
• RS232 ports - Includes Adapter Plates
• Intel 2.5 in Solid State Drives
• 2-Drawer drive carrier for 2.5 in drives
• DVD/DL Drive
Type Acousto-optic Q-switched,
TEM00Nd: YLF diode-pumped laser

Wavelength 1053 nm
Pulse Stability<0.5% at 1 khz

Optics Flat field focusing lens

Spot Size 50-110 μm

Depth 5-110 μm +/-10%
• Keyboard and flat panel display
• Menu-driven "fill in the blank" software
• Multiple job file storage capability
• Fault and error logging capabilities
• System diagnostic indicators displayed on front panel and electronic console
• SECS II/GEM interface
• Four color programmable signal tower

CE Mark
SEMI S2, S8, S14

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